3240
H3240-A
3025、H3136
H3025-A
3021
H3021-A
H3024-4
H3233
Laminated bar
 
 
FR-4 Covered copperplate
XPC Covered copperplate
phenolic paper potential device board
FR-4 paintless board
 
 
0510-86201262(803)
  0510-86201263
 
 
 
  Phenol aldehyde paper board series  
H3024—4phenolic paper potential device board (H3024—5 bakelite board
 
1 .Definite and purpose
   This product is a kind of laminated board formed through heat processing by bleaching wood pulp dips into PF resins, used for all kinds of potential device and as printed wiring board pad.
 
2 .Technical requirement
 2.1 Outside appearance
    The surface should be flat and smooth, color is in uniformity, does not allow any impurity, bubble, pitting & knob spot on it. There is no black spot at basic material. The heavy scrape and nick is not allowed. The edge is cut tidy and the end surface has no crackle, delamination or slag dropping.
 2.2 Main performance index
H3024-4 H3024-5
 
Table 1 : Performance index  

Sr.

Index name

Unit

Index

1

Warp or distort

Mm

≤10

2

Water absorption rate

%

≤4.8

3

Insulation resistance

Normal status

Ω

≥1.0×109

After boiling

≥1.0×107

4

Water absorbing expansion rate

Portrait

%

≤0.3

Cross direction

≤0.5

5

Heat resistant performance

A:210℃15Min

%

No delamination or bubble.

B: portrait size changes after damped.

≤0.35

 
Note: For additional technical requirement,the color can be negotiated by supplier and purchaser.
 
 

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