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Printed-wiring copper foil covered epoxy glass cloth laminated board GB4725—92 |
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| 1 ．Definite and purpose |
| This product is a kind of copper foil covered laminated board (foil covered board for short below) formed through heat pressing after the electric industry alklifree glass fibre dips into epoxy resins and is covered with copper foil(s) at one side or both sides. |
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| 2 ．Model and characteristics |
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Model |
Performance |
CEPGC-31 |
General type |
CEPGC-32F |
Antiflame type |
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| 3 ．Technical requirement |
3.1 Outside appearance
A.The end face of foil covered board should be tidy without any delamination and crackle.
B. Any bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered face is not allowed. Any color changing or dirty can be easily removed by density 1.02 g/cm3 hydrochloric acid or proper organic solution.
C. On laminated face, the defects such as bubble, impressed pitting, nick and glue lack and outer impurity which retard its use are not allowed.
3.2 The foil covered board should meet with the requirements of all items of non electric performance listed at table 2.
3.3 Non performance of insulation basic material after all copper foil removal.
3.3.1 On insulation basic material, the pitting, cavity hole, glue lack, white spot, loosen or outer impurity (including solid resin grains) which retard its use are not allowed. The color should be uniform. A little irregular change of color is allowed.
3.3.2 After all copper foils on the foil covered board are removed according to the stipulations on Chapter 3 of GB/T4722, the insulation basic material performance should meet with the stipulation on table 3. |
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Sr. |
Index name |
Test method in GB/T4722-92 |
Index |
CEPGC-31 |
CEPGC-32F |
1 |
Anti-peeling strength N Not less than: |
15 |
60 |
60 |
2 |
Peeling strength (N/mm)Not less than:
After dipping for 20sCopper foil ≥35μm
Copper foil 18μm
After 125℃ heating & dryingCopper foil≥35μm Copper foil 18μm
Be exposed at 1.1.1 – trichloroethaneCopper foil ≥35μm
After ethane steamingCopper foil 18μm
After treatment of simulated electric plating Copper foil≥35μm
Copper foil 18μm
At125℃ (Note: 1)Copper foil≥35μm
Copper foil 18μm
At 260℃ (Note: 2)Copper foil ≥35μm
Copper foil 18μm |
16 |
1.4
1.1
1.4
1.1
1.4
1.1
1.1
0.9
0.9
0.7
0.075
0.06 |
1.4
1.1
1.4
1.1
1.4
1.1
0.3
0.65
0.9
0.7
0.075
0.06 |
3 |
The bubbling test after heat punch for 20s |
Chapter 17 |
No delamin-ation or bubbling |
No delamin-ation or bubbling |
4 |
Weldability (Note 3), S
Wetting test
Copper foil 35μm
Board thickness from 0.5mm to 1.6mm
Board thickness from over 1.6mm to 6.4mm
Copper foil 70μm
Semi-wetting test |
Chapter 20 |
2
3
3
5+10
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2
3
3
5+10
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5 |
Punch performance |
Chapter 18 |
As per negotiated by both parties. |
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Note:
1. Except for trichloroethane , the adopted solvent steam can be negotiated by both parties.
2. Select one item at will.
3. If the copper foil thickness is more than 70μm or board thickness is more than 6.4 mm, the wetting and semi-wetting time should be negotiated by both parties. |
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Sr. |
Index name |
GB/T4722-92 Chapter Test Method |
Index |
CEPGC-31 |
CEPGC-32F |
1 |
Bending strength，MP ais not less than（board thickness 1.0mm and larger） |
25 |
300 |
300 |
2 |
Flammability, Classification, vertical method |
26 |
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FV0 or FV1 |
3 |
water absorption（mg Board thickness）not more than 0.5mm
0.7mm
0.8mm
1.0mm
1.2mm
1.5mm
1.6mm
2.0mm
2.4mm
3.2mm
6.4mm |
27 |
20
20
20
20
20
20
20
21
22
25
32
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20
20
20
20
20
20
20
21
22
25
32
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4 |
White spot |
28 |
No bubble, no white spot, no delamination |
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| Note: The thickness is actual measured average value. For non nominal thickness, it can be carrid out according to the one class bigger than nominal value. |
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